Samsung and Tenstorrent are developing a new generation of AI chiplets based on the RISC-V architecture

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A promising alliance could take over the chip industry in the near future.

Tenstorrent, an AI chip company, recently announced a collaboration with Samsung to build advanced next-generation chiplets based on the RISC-V architecture.

Samsung has captured the attention of the entire industry with the latest developments in its semiconductor division. Of particular interest was the company's 3-nanometer GAA process, which is already being considered by major market players such as NVIDIA and AMD for future use in their own products. In addition, Samsung Foundry has improved its process technology and is currently planning to expand its chip development activities.

Tenstorrent has been chosen as the Korean giant's next partner. The company plans to produce its next-generation RISC-V chiplet for the artificial intelligence market, using Samsung's SF4X process, the most advanced 4-nanometer node offered by the division. Tenstorrent also recently raised $ 100 million in investment from Hyundai and Samsung to build AI chips that will compete with NVIDIA.

The goal of Tenstorrent is to develop high-performance computing solutions and provide them to customers around the world. "It's great that we have Keith Whitek as our chief Operating Officer to lead partnerships like this one with Samsung right now. Samsung Foundry's commitment to developing semiconductor technology is consistent with our vision to advance RISC-V and AI, " said Jim Keller, CEO of Tenstorrent.

Samsung's vision for its semiconductor division is pretty broad. The company is trying to make the most of any opportunities, especially in light of the growing interest in AI.

Following efforts to implement NVIDIA's hybrid supply chain model, Samsung has strengthened its ties with Team Red and taken responsibility for fulfilling orders for HBM for AMD's Instinct MI300X AI accelerators.

In general, Samsung is now in a favorable position, having the necessary capacity for production at all stages, including memory and chips, which reduces the complexity of cooperation with several market players at once.
 
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